RMPA0959-108 Raytheon RF Components, RMPA0959-108 Datasheet - Page 13

• Manufacturer Part Number: RMPA0959-108
• Description: Type = Cellular Power Amplifier ;; Circuit Description = 3V Cellular Band Amps, Cdma & CDMA2000 Power Amplifier Module ;; Frequency = 824-849 MHZ
• Manufacturer: Raytheon RF Components

RF Components
www.raytheonrf.com
Application
Information
Continued
Specifications are based on most current or latest revision.
Revised April 16, 2003
RMPA0959-108
CDMA and CDMA2000-1X Power Amplifier Module
Device Usage: Raytheon recommends the following procedures prior to assembly.
Solder Materials & Temperature Profile: Reflow soldering is the preferred method of
SMT attachment. Hand soldering is not recommended.
Reflow Zone: If the temperature is too high, then devices may be damaged by
mechanical stress due to thermal mismatch or there may be problems due to
excessive solder oxidation. Excessive time at temperature can enhance the
formation of inter-metallic compounds at the lead/board interface and may lead to
early mechanical failure of the joint. Reflow must occur prior to the flux being
completely driven off. The duration of peak reflow temperature should not exceed
10 seconds. Maximum soldering temperatures should be in the range 215-220°C,
with a maximum limit of 225°C.
Cooling Zone: Steep thermal gradients may give rise to excessive thermal shock.
However, rapid cooling promotes a finer grain structure and a more crack-resistant
solder joint. The illustration below indicates the recommended soldering profile.
Solder Joint Characteristics: Proper operation of this device depends on a reliable
void-free attachment of the heatsink to the PWB. The solder joint should be 95%
void-free and be a consistent thickness.
Rework Considerations: Rework of a device attached to a board is limited to reflow of
the solder with a heat gun. The device should not be subjected to more than 225°C
and reflow solder in the molten state for more than 5 seconds. No more than 2
rework operations should be performed.
Dry-bake devices at 125 C for 24 hours minimum. Note: The shipping trays
cannot withstand 125 C baking temperature.
Assemble the dry-baked devices within 7 days of removal from the oven.
During the 7-day period, the devices must be stored in an environment of less
than 60% relative humidity and a maximum temperature of 30 C
If the 7-day period or the environmental conditions have been exceeded, then
the dry-bake procedure must be repeated.
Reflow Profile
" Ramp-up: During this stage the solvents are evaporated from the solder
" Pre-heat/soak: The soak temperature stage serves two purposes; the flux
paste. Care should be taken to prevent rapid oxidation (or paste slump)
and solder bursts caused by violent solvent out-gassing. A typical heating
rate is 1- 2°C/sec.
is activated and the board and devices achieve a uniform temperature. The
recommended soak condition is: 120-150 seconds at 150°C.
Page 13
ADVANCED INFORMATION
Raytheon RF Components
Andover, MA 01810
362 Lowell Street