IRF7601 International Rectifier, IRF7601 Datasheet

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IRF7601

Manufacturer Part Number
IRF7601
Description
Power MOSFET(Vdss=20V/ Rds(on)=0.035ohm)
Manufacturer
International Rectifier
Datasheet

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Description
Absolute Maximum Ratings
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The new Micro8 package, with half the footprint area of the
standard SO-8, provides the smallest footprint available in
an SOIC outline. This makes the Micro8 an ideal device for
applications where printed circuit board space is at a
premium. The low profile (<1.1mm) of the Micro8 will allow
it to fit easily into extremely thin application environments
such as portable electronics and PCMCIA cards.
Thermal Resistance
All Micro8 Data Sheets reflect improved Thermal Resistance, Power and Current -Handling Ratings- effective
R
only for product marked with Date Code 505 or later .
I
I
I
P
V
dv/dt
T
D
D
DM
J,
D
GS
JA
@ T
@ T
T
Generation V Technology
Ultra Low On-Resistance
N-Channel MOSFET
Very Small SOIC Package
Low Profile (<1.1mm)
Available in Tape & Reel
Fast Switching
@T
STG
A
A
A
= 25°C
= 70°C
= 25°C
Maximum Junction-to-Ambient
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
Parameter
Parameter
GS
GS
@ 4.5V
@ 4.5V
G
S
S
S
1
2
3
4
T o p V ie w
Typ.
–––
8
7
6
5
-55 to + 150
HEXFET
Max.
± 12
Micro8
5.7
4.6
1.8
5.0
30
14
D
D
D
D
A
A
Max.
®
R
IRF7601
70
DS(on)
Power MOSFET
V
PD - 9.1261D
DSS
= 0.035
= 20V
mW/°C
°C/W
Units
Units
V/ns
°C
W
A
V
8/25/97

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IRF7601 Summary of contents

Page 1

... All Micro8 Data Sheets reflect improved Thermal Resistance, Power and Current -Handling Ratings- effective only for product marked with Date Code 505 or later . 4. 4.5V GS Typ. ––– 9.1261D IRF7601 ® HEXFET Power MOSFET 20V DSS 0.035 ...

Page 2

... IRF7601 Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge ...

Page 3

... ° µ te-to-S o urce V oltage ( Fig 3. Typical Transfer Characteristics IRF7601 100 VGS TOP 7.5V 5.0V 4.0V 3.5V 3.0V 2.5V 2.0V BOTT OM 1. µ LSE W IDTH 0°C J 0.1 0.1 1 ...

Page 4

... IRF7601 1200 iss 1000 800 600 400 200 rain-to-S ource Voltage ( Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage ° 25° ...

Page 5

... SINGLE PULSE (THERMAL RESPONSE) 0.1 0.00001 0.0001 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient + V DS D.U. 0.001 0.01 0 Rectangular Pulse Duration (sec) 1 IRF7601 D.U. 4.5V Pulse Width µs Duty Factor Fig 10a. Switching Time Test Circuit V DS 90% 10 ...

Page 6

... IRF7601 D.U Reverse Recovery Current Re-Applied Voltage Peak Diode Recovery dv/dt Test Circuit + Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - dv/dt controlled by R Driver same type as D.U.T. I controlled by Duty Factor "D" SD D.U.T. - Device Under Test Driver Gate Drive Period P ...

Page 7

... ( IRF7601 ...

Page 8

... IRF7601 Tape & Reel Information Micro8 Dimensions are shown in millimeters (inches & TES : LLING DIME NSIO ILLIMET ER. 2. OUT LINE CON FO RMS T O EIA -481 & ...

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