CMPA0060002D Cree, Inc., CMPA0060002D Datasheet - Page 5

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CMPA0060002D

Manufacturer Part Number
CMPA0060002D
Description
Cree, Cmpa0060002f 2w, Gan Hemt Mmic Cree Wireless , Driver Amplifier
Manufacturer
Cree, Inc.
Datasheet

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External Termination Reference Design
The following is a plot of the gain of the die only.
Notes:
1
2
frequencies.
LRC Reference Circuit
The Drain and Gate circuit use the same L and C components but different values for the resistor.
The Drain resistor needs to be dimensioned to handle 3 W of RF dissipation for the lowest frequencies while the Gate
resistor needs to handle 0.5 W. The suppliers of the SMT components are:
L1 = 47 nH, CoilCraft PN: 0402CS –47NXJB
C1 = 470 pf Murata PN: GRM1885C2A471A01D
Copyright © 2009-2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
and the Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their
respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association.
5
An off chip termination is needed to reduce the high gain peak at low frequencies.
The off chip termination should be designed to minimize the impact on the MMIC’s performance at higher
CMPA0060002D Rev 0.5, Preliminary
30
28
26
24
22
20
18
16
14
12
10
0.0
0.5
1.0
1.5
2.0
2.5
Frequency (GHz)
Figure 2.
Die only
3.0
3.5
4.0
4.5
S21 (Die Only)
5.0
5.5
6.0
USA Tel: +1.919.313.5300
www.cree.com/wireless
Fax: +1.919.869.CREE
Durham, NC 27703
4600 Silicon Drive
Cree, Inc.

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