CMPA0060002D Cree, Inc., CMPA0060002D Datasheet - Page 3

• Manufacturer Part Number: CMPA0060002D
• Description: Cree, Cmpa0060002f 2w, Gan Hemt Mmic Cree Wireless , Driver Amplifier
• Manufacturer: Cree, Inc.

Die Dimensions (units in inches)
Die Assembly Notes:
Copyright © 2009-2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
and the Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their
respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association.
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Recommended solder is AuSn (80/20) solder. Refer to Cree’s website for the Eutectic Die Bond Procedure
application note at www.cree.com/wireless.
Vacuum collet is the preferred method of pick-up.
The backside of the die is the Source (ground) contact.
Die back side gold plating is 5 microns thick minimum.
Thermosonic ball or wedge bonding are the preferred connection methods.
Gold wire must be used for connections.
Use the die label (XX-YY) for correct orientation.
CMPA0060002D Rev 0.5, Preliminary
Notes:
1
The RF In and Out pads have a ground-signal-ground configuration with a pitch of 0.010 inches.
Pad Number
1
2
3
4
Overall die size 0.169 x 0.066 (+0/-0.005) inches, die thickness 0.004 inches.
All Gate and Drain pads must be wire bonded for electrical connection.
RF IN
Gate Termination
Drain Termination
RF OUT
Function
1
1
RF-Input pad. Matched to 50 ohm. Requires gate control from
an external bias –T from -2.3 V to -3.8 V.
Off Chip termination for the Gate. It needs to be DC-blocked .
Off Chip termination for the Drain. It needs to be DC-blocked.
RF-Output pad. Matched to 50 ohm. Requires Drain supply
from an external bias –T up to 26 V , 800 mA
Description
0.008” x 0.006”
0.008” x 0.006”
0.008” x 0.006”
0.008” x 0.006”
Pad Size (in)
USA Tel: [phone]
www.cree.com/wireless
Fax: [phone].CREE
Durham, NC 27703
4600 Silicon Drive
Cree, Inc.