MC74HCT541ADWR2 ON Semiconductor, MC74HCT541ADWR2 Datasheet - Page 7

no-image

MC74HCT541ADWR2

Manufacturer Part Number
MC74HCT541ADWR2
Description
IC BUFF/DVR TRI-ST 8BIT 20SOIC
Manufacturer
ON Semiconductor
Series
74HCTr
Datasheet

Specifications of MC74HCT541ADWR2

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
6mA, 6mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
MC74HCT541ADWOSCT
0.15 (0.006) T
0.15 (0.006) T
L
2X
−T−
U
PIN 1
IDENT
U
L/2
C
0.100 (0.004)
S
S
SEATING
PLANE
20
1
D
20X
−V−
0.10 (0.004)
A
K
REF
G
H
M
PACKAGE DIMENSIONS
10
11
T
U
http://onsemi.com
MC74HCT541A
−U−
CASE 948E−02
S
B
DT SUFFIX
TSSOP−20
V
ISSUE B
S
7
J J1
N
N
DETAIL E
Í Í Í Í
Í Í Í Í
Í Í Í Í
SECTION N−N
DETAIL E
F
K1
0.25 (0.010)
K
M
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION:
3. DIMENSION A DOES NOT INCLUDE
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
PER ANSI Y14.5M, 1982.
MILLIMETER.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
6.40
4.30
0.05
0.50
0.27
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
6.60
4.50
1.20
0.15
0.75
0.37
0.20
0.16
0.30
0.25
8
_
0.252
0.169
0.002
0.020
0.011
0.004
0.004
0.007
0.007
MIN
−−−
0
0.026 BSC
0.252 BSC
_
INCHES
0.260
0.177
0.047
0.006
0.030
0.015
0.008
0.006
0.012
0.010
MAX
8
_

Related parts for MC74HCT541ADWR2