MC74HCT541ADWR2 ON Semiconductor, MC74HCT541ADWR2 Datasheet - Page 6

• Manufacturer Part Number: MC74HCT541ADWR2
• Description: IC BUFF/DVR TRI-ST 8BIT 20SOIC
• Manufacturer: ON Semiconductor
• Series: 74HCTr

Specifications of MC74HCT541ADWR2

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 8
• Current - Output High, Low: 6mA, 6mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: MC74HCT541ADWOSCT

SEATING
PLANE
−T−
20
1
20
1
G
18X
20X
E
e
B
0.25
D
−A−
F
M
T
A
S
D
B
10
20 PL
11
10
11
S
0.25 (0.010)
A1
B
E
N
A
A
B
T
PACKAGE DIMENSIONS
SEATING
PLANE
K
M
http://onsemi.com
MC74HCT541A
C
T
CASE 751D−05
CASE 738−03
A
DW SUFFIX
SO−20 WB
N SUFFIX
ISSUE G
PDIP−20
ISSUE E
M
6
C
J
L
20 PL
0.25 (0.010)
q
M
M
T
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
B
PER ASME Y14.5M, 1994.
PROTRUSION.
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
M
DIM
A1
A
B
C
D
E
H
h
L
q
e
NOTES:
12.65
10.05
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
MILLIMETERS
MIN
2.35
0.10
0.35
0.23
7.40
0.25
0.50
1.27 BSC
0
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
_
DIM
M
A
B
C
D
E
F
G
K
L
N
J
12.95
10.55
MAX
2.65
0.25
0.49
0.32
7.60
0.75
0.90
1.010
0.240
0.150
0.015
0.050
0.008
0.020
7
0.110
MIN
_
0.050 BSC
0.100 BSC
0.300 BSC
0
INCHES
_
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
MAX
15
_
25.66
MILLIMETERS
MIN
6.10
3.81
0.39
1.27
0.21
2.80
0.51
1.27 BSC
2.54 BSC
7.62 BSC
0
_
MAX
27.17
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15
_