FMM5823X Eudyna Devices, Inc., FMM5823X Datasheet - Page 14

• Manufacturer Part Number: FMM5823X
• Description: K-Band Power Amplifier MMIC
• Manufacturer: Eudyna Devices, Inc.

K-Band Power Amplifier MMIC
■ ■ ■ ■ DIE ATTACH
1) The die-attach station must have accurate temperature control and an inert forming gas should
2) Chips should be kept at room temperature except during die-attach.
3) Place package or carrier on the heated stage.
4) Lightly grasp the chip edges by the longer side using tweezers.
■ ■ ■ ■ WIRE BONDING
1) Bonding Equipment and Bonding Tool.
2) Bonding Wire
3) Bonding Conditions
FMM5823X
The bonding equipment must be properly grounded. The following or equivalent equipment, tools,
materials, and conditions are recommended.
be used.
Die attach conditions
Stage Temperature : 300 to 310 deg.C
Time : less than 15 seconds
AuSn Preform Volume : per next Figure
Bonding Equipment : West Bond Model 7400 (Manual Bonder)
Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl)
Material : Hard or Half hard gold
Diameter : 0.7 to 1.0 mil
Method : Thermal Compression Bonding with Ultrasonic Power
Tool Force : 0.196 N ± 0.0196 N
Stage Temperature : 215 deg.C ± 5 deg.C
Tool Heater : None
Ultrasonic Power Transmitter : West Bond Model 1400
Duration : 150 mS/Bond
2500
2000
1500
1000
500
0
0
2
FMM5823X
4
Area of Chip Back Surface (mm^2)
6
8
10
14
12
14
16
18
20