FMM5823X Eudyna Devices, Inc., FMM5823X Datasheet - Page 12

• Manufacturer Part Number: FMM5823X
• Description: K-Band Power Amplifier MMIC
• Manufacturer: Eudyna Devices, Inc.

K-Band Power Amplifier MMIC
FMM5823X
■ ■ ■ ■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
RF-IN
1250
1145
445
105
0
Ｎｏｔｅ : Drain voltage is required from either or both bonding pad( VDD4 or/and VDD5).
Ｎｏｔｅ
Ｎｏｔｅ
Ｎｏｔｅ
0
0
105
VGG
685
VDD1
975
VDD2
1545
12
Chip Size : 3665± ± ± ± 30um x 1250± ± ± ± 30um
Chip Thickness : 60± ± ± ± 20um
Bonding Pad Size :
VDD3
2090
RF-Pad : 80um x 160um
VGG, VDD1~3 Pad : 80um x 80um
VDD4, VDD5 Pad : 160um x 80um
VGG4
(VDD5)
2775
2775
3560
3665
3665
RF-OUT
645
1250
1135
115
0