BS-115C Bestar, BS-115C Datasheet - Page 5

• Manufacturer Part Number: BS-115C
• Description: Miniature Relay
• Manufacturer: Bestar

JM Elektronik
Ul. Karolinki 58
44-100 Gliwice
1. Mounting of Relay
2. Flux Coating
3. Preheating
4. Soldering
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Process
Relay Soldering and Washing Guidelines
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Automatic Soldering
Hand Soldering
Avoid bending the terminals to make the relay self-clinching. Relay performance cannot
be guaranteed if the terminals are bent.
Adjust the position of the PC board so that flux does not overflow onto the top of it.
Use rosin-based flux, which is non-corrosive and requires no washing.
Do not use Automatic Flux Coating Method to dust-covertype relays.
Do not overflow onto the top of PC Board, in such a case the flux
may even penetrate a flux-resistant type relay.
Be sure to preheat before soldering.
Preheating acts to improve solderability.
Preheat according to the following conditions.
Note that long exposure to high temperatures (e.g. due to a malfunctioning unit) may
affect relay characteristics.
Flow solder is the optimum method for soldering.
Adjust the level of solder so that it does not overflow onto the top ofthe PC board.
Unless otherwise specified, solder under the following conditions depending on the type
of relay.
Keep the tip of the soldering iron clean.
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Iron Tip Temperature
Solder Temperature
Temperature
Soldering Time
Solder Ratio
Solder Time
Solder Iron
Time
Guidelines
Within approx. 1 minute
100°C / 212°F or less
Within approx. 5 seconds
Approx. 250°C / 482°F
Sn/Pb = 60/40 or 63/37
Withinapprox. 3 seconds
Approx. 300°C / 573°F
30W to 60W
Strona 5 z 6