TSOP62xx Vishay Siliconix, TSOP62xx Datasheet - Page 7

• Manufacturer Part Number: TSOP62xx
• Description: IR Receiver Modules
• Manufacturer: Vishay Siliconix

Assembly Instructions
Reflow Soldering
•
while stored under a max. temperature of 30 °C, 60 %
RH after opening the dry pack envelope.
•
heating in accordance with the reflow temperature
profile as shown in the diagram. Excercise extreme
care to keep the maximum temperature below
260 °C. The temperature shown in the profile means
the temperature at the device surface. Since there is
a temperature difference between the component and
the circuit board, it should be verified that the temper-
ature of the device is accurately being measured.
•
work surface has been cooled off.
Manual Soldering
•
temperature of the soldering iron below 300 °C.
•
•
cooled off.
Document Number 82177
Rev. 1.5, 23-Oct-06
Reflow soldering must be done within 72 hours
Set the furnace temperatures for pre-heating and
Handling after reflow should be done only after the
Use a soldering iron of 25 W or less. Adjust the
Finish soldering within three seconds.
Handle products only after the temperature has
Vishay Leadfree Reflow Solder Profile
300
250
200
150
100
19800
50
0
0
255 °C
240 °C
217 °C
max. Ramp Up 3 °C/sec
50
max. 120 sec
100
Vishay Semiconductors
t [sec]
150
max. Ramp Down 6 °C/sec
TSOP62..
max. 100 sec
200
max. 20 s
max. 2 cycles allowed
www.vishay.com
max. 260 °C
250
245 °C
300
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