BGA2714 NXP Semiconductors, BGA2714 Datasheet - Page 3

• Manufacturer Part Number: BGA2714
• Description: MMIC Wideband Amplifier
• Manufacturer: NXP Semiconductors

NXP Semiconductors
6. Thermal characteristics
7. Characteristics
BGA2714_1
Product data sheet
Table 6.
Table 7.
V
Symbol
R
Symbol Parameter
I
G
RL
RL
ISL
NF
B
K
P
P
SUP
SUP
L(sat)
L(1dB)
th(j-sp)
p
3dB
in
out
= 3 V; I
supply current
power gain
input return loss
output return loss
isolation
noise figure
Rollet stability factor
saturated output power
output power at 1 dB gain compression f = 250 MHz
3 dB bandwidth
Thermal characteristics
Characteristics
Parameter
thermal resistance from junction to
solder point
SUP
= 4.58 mA; T
Rev. 01 — 24 May 2007
amb
= 25 C; measured on demo board; unless otherwise specified.
Conditions
P
tot
Conditions
f = 100 MHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
f = 2500 MHz
f = 3000 MHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
3 dB below gain
at 1 GHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
f = 950 MHz
f = 2150 MHz
= 200 mW; T
sp
= 90 C
MMIC wideband amplifier
Min
3.7
20
20
20
20
19
16
11
7
12
10
10
8
55
55
45
-
-
-
-
25
35
7
3
4
6
8.5
8.7
10
BGA2714
© NXP B.V. 2007. All rights reserved.
Typ
4.58
20.8
20.7
20.4
20.8
19.5
16.8
13.9
8.9
15.9
10.6
10.8
9.8
58
59
49
2.4
2.2
3.0
2.7
30
47
10
2.4
3.4
4.7
7.8
7.9
9
Typ
300
Max Unit
5.7
21
21
21
22
21
18
-
-
-
-
-
-
-
-
-
2.5
2.3
3.2
-
-
-
-
-
-
-
-
-
-
Unit
K/W
3 of 15
mA
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
GHz
dBm
dBm
dBm
dBm
dBm
dBm