CMM0224-BD Celeritek, CMM0224-BD Datasheet
![no-image](/images/no-image-200.jpg)
CMM0224-BD
Manufacturer Part Number
CMM0224-BD
Description
Wideband Devices, 2 GHZ to 24 GHZ
Manufacturer
Celeritek
Datasheet
1.CMM0224-BD.pdf
(2 pages)
2.0 to 24.0 GHz
GaAs MMIC
Power Amplifier
Advanced Product Information
April 2003
Features
❏ Small Size: 43 x 92 mils
❏ High Gain
❏ Directly Cascadable
❏ Medium Power: +24 dBm
❏ Ion-Implanted Active Layers
❏ Silicon Nitride Passivation
Absolute Maximum Ratings
3236 Scott Boulevard
Parameter
Drain Voltage
Drain Current
Continuous Power Dissipation
Channel Temperature
Storage Temperature
Mounting Temperature
Input Power
Specifications (T A = 25°C, V DD = 8V)
Parameters
Frequency Range
Small Signal Gain
Gain Flatness
Input/Output VSWR
Power Output (@1 dB Gain Compression)
Second Order Intercept Point
Third Order Intercept Point
Current
Santa Clara, California 95054
-65°C to +175°C
+23 dBm
360 mA
+175°C
+320°C
Rating
3.0 W
12V
(1 of 2)
Units
dBm
dBm
dBm
GHz
±dB
mA
dB
—
Die Attach and Bonding Procedures
Chip Diagram
Die Attach: Eutectic die attach is recommended. For eutec-
tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage
Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1
min or less.
Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over
thermosonic bonding.
Stage Temperature: 250°C; Bond Tip Temperature: 150°C;
Bonding Tip Pressure: 18 to 40 gms depending on size of
wire.
Phone: (408) 986-5060
22.0
11.0
300
Min
2.0
CMM0224-BD
For thermocompression bonding:
1.8:1
12.0
24.0
40.0
30.0
Typ
0.5
Fax: (408) 986-5095
2.0:1
24.0
0.85
Max
330