CMM0016-BD Celeritek, CMM0016-BD Datasheet

CMM0016-BD

Manufacturer Part Number

CMM0016-BD

Description

GAAS Mmic 1W Poweramplifier Broadband Amplifier Chips 2 GHZ to 18 GHZ

Manufacturer

Celeritek

Datasheet

1.CMM0016-BD.pdf (4 pages)

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2.0 to 18.0 GHz

GaAs MMIC

1W Power Amplifier

Advanced Product Information

June 2004

Features

❏ Small Size: 2.32 x 1.30 x 0.076 mm

❏ Integrated On-Chip DC Blocking

❏ Single Bias Operation

❏ Directly Cascadable – Fully Matched

❏ P1dB: 30 dBm, Typ. @ 18 GHz

❏ Linear Gain: 9.5 dB, Typ. @ 18 GHz

❏ pHEMT Technology

❏ Silicon Nitride Passivation

Absolute Maximum Ratings

Parameter

Drain Voltage

Drain Current

Continuous Power Dissipation

Input Power

Storage Temperature

Channel Temperature

Operating Backside Temperature

Notes: 1. Tested on Celeritek connectorized evaluation board.

Notes: 1. Operation outside these limits can cause permanent damage.

3236 Scott Boulevard

Specifications (TA = 25°C, Vdd = 12V)

Parameters

Frequency Range

Linear Gain

Gain Variation (over operating frequency)

P1dB Variation (over operating frequency)

Power Output (@1 dB Gain Compression)

Saturated Output Power

Third Order Intercept Point (@ 10 GHz)

Noise Figure (@10 GHz)

Input Reflection Coefficient

Output Reflection Coefficient

Current

Thermal Resistance

Stability 2

2. Calculation maximum operating temperature:

Tmax = 150–(Pdis [W] x 7.5) [°C].

Santa Clara, California 95054

9V (min.) / 13V (max.)

-50°C to +150°C

800 mA

20 dBm

Rating

150°C

9.2 W

-40°C

(1 of 4)

°C/W

dBm

Units

GHz

±dB

Die Attach and Bonding Procedures

Chip Diagram

Die Attach: Eutectic die attach is recommended. For eutec-

tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage

Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1

min or less.

Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-

stressed); Thermocompression bonding is preferred over

thermosonic bonding.

Stage Temperature: 250°C; Bond Tip Temperature: 150°C;

Bonding Tip Pressure: 18 to 40 gms depending on size of

wire.

Unconditionally Stable

Phone: (408) 986-5060

28.5

29.5

650

2.0

8.5

Min

CMM0016-BD

For thermocompression bonding:

Units: mm

700

5.5

Typ

Fax: (408) 986-5095

-10.0

18.0

12.5

32.0

33.0

750

Max

2.5

3.5

7.5

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