STM1/4/16 Philips Semiconductors (Acquired by NXP), STM1/4/16 Datasheet - Page 28
STM1/4/16
Manufacturer Part Number
STM1/4/16
Description
Sdh/sonet Data And Clock Recovery Unit
Manufacturer
Philips Semiconductors (Acquired by NXP)
Datasheet
1.STM1416.pdf
(36 pages)
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Philips Semiconductors
BONDING PADS
1999 May 27
handbook, full pagewidth
SDH/SONET data and clock recovery unit
STM1/4/16 OC3/12/48 GE
2.360
mm
CLOOPQ
DLOOPQ
DREF19
CLOOP
DLOOP
LOCK
GND
GND
GND
GND
GND
ENL
10
12
11
1
2
3
4
5
6
7
8
9
Fig.30 Bonding pad locations of OQ2541U.
13
48
47
14
15
46
16
45
44
17
x
OQ2541U
2.360 mm
28
18
43
0
y
0
19
42
41
20
40
21
39
22
38
23
OQ2541HP; OQ2541U
37
24
MGL664
36
35
34
33
32
31
30
29
28
27
26
25
i.c.
GND
DINQ
DIN
GND
V EE2
DOUT155
GND
DOUT622
DOUT1250
GND
V EE1
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