STM1/4/16 Philips Semiconductors (Acquired by NXP), STM1/4/16 Datasheet - Page 13
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STM1/4/16
Manufacturer Part Number
STM1/4/16
Description
Sdh/sonet Data And Clock Recovery Unit
Manufacturer
Philips Semiconductors (Acquired by NXP)
Datasheet
1.STM1416.pdf
(36 pages)
Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
HANDLING INSTRUCTIONS
Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during
assembly and handling of the bare die. Additional safety can be obtained by bonding the V
remaining pads may then be bonded to their external connections in any order.
THERMAL CHARACTERISTICS
Note
1. Thermal resistance from junction to ambient is determined with the IC soldered on a standard single sided
1999 May 27
V
V
I
P
T
T
T
R
R
SYMBOL
SYMBOL
n
amb
j
stg
EE
n
tot
th(j-s)
th(j-a)
SDH/SONET data and clock recovery unit
STM1/4/16 OC3/12/48 GE
57
57
negative supply voltage
DC voltage on pins
input current on pins
total power dissipation
ambient temperature
junction temperature
storage temperature
thermal resistance from junction to solder point
thermal resistance from junction to ambient
1.6 mm FR4 epoxy PCB with 35 m thick copper traces. The measurements are performed in still air.
CLOOP, CLOOPQ, DLOOP, DLOOPQ, CREF, CREFQ, DIN, DINQ,
DOUT, DOUTQ, COUT and COUTQ
ENL, LOCK and LOS,
DREF19, DREF39, DOUT1250, DOUT622, DOUT155, PC and AREF V
CAPUPQ and CAPDOQ
ENL
CREF, CREFQ, DIN and DINQ
PARAMETER
PARAMETER
13
in free air; note 1
CONDITIONS
OQ2541HP; OQ2541U
V
V
6
1
20
40
40
65
EE
EE
EE
MIN.
VALUE
+ 0.5
EE
0.5 +5.5
0.5 +0.5
46
67
and GND pads first, the
+0.5
+0.5
1
+10
700
+85
+110
+150
Product specification
0.5
MAX.
UNIT
K/W
K/W
V
V
V
V
V
mA
mA
mW
C
C
C
UNIT