MAX1161 Maxim, MAX1161 Datasheet - Page 5

• Manufacturer Part Number: MAX1161
• Description: 10-Bit / 40Msps / TTL-Output ADC
• Manufacturer: Maxim

(T
__________________________________________Typical Operating Characteristics
The MAX1161 requires few external components to
achieve the stated operation and performance. Figure 2
shows the typical interface requirements when using the
MAX1161 in normal circuit operation. The following sec-
tion provides a description of the pin functions, and out-
lines critical performance criteria to consider for
achieving optimal device performance.
The MAX1161 requires -5.2V and +5V analog supply
voltages. The +5V supply is common to analog V
digital DV
line reduces the transient noise injected into the analog
_______________Detailed Description
A
80
70
60
50
40
30
20
80
70
60
50
40
30
20
= +25°C, unless otherwise noted.)
1
1
TOTAL HARMONIC DISTORTION vs.
f
S
f
IN
= 40Msps
= 1MHz
CC
INPUT FREQUENCY (MHz)
SNR, THD, SINAD vs.
INPUT FREQUENCY
SAMPLE RATE (Msps)
. A ferrite bead in series with each supply
SAMPLE RATE
SINAD
SNR
Power Supplies and Grounding
_______________________________________________________________________________________
10
10
THD
100
100
10-Bit, 40Msps, TTL-Output ADC
80
70
60
50
40
30
20
65
60
55
50
45
40
-25
1
f
f
S
IN
f
S
= 40Msps
= 40Msps
= 1MHz
CC
SIGNAL-TO-NOISE vs.
0
INPUT FREQUENCY (MHz)
SNR, THD, SINAD vs.
INPUT FREQUENCY
and
SNR
TEMPERATURE (°C)
TEMPERATURE
25
10
SINAD
V
device as possible. The connection between the beads
and the MAX1161 should not be shared with any other
device. Bypass each power-supply pin as close to the
device as possible. Use 0.1µF for V
0.01µF for DV
The MAX1161 has two grounds: AGND and DGND.
These internal grounds are isolated on the device. Use
ground planes for optimum device performance.
Use DGND for the DV
and for the return path for all digital output logic inter-
faces. Separate AGND and DGND from each other,
connecting them together only through a ferrite bead at
the device.
CC
50
. These beads should be connected as close to the
THD
75
100
CC
(chip capacitors are recommended).
-120
60
-30
-60
-90
80
70
50
40
30
20
0
CC
1
0
SIGNAL-TO-NOISE AND DISTORTION
f
S
return path (typically 40mA)
= 40Msps
2
vs. INPUT FREQUENCY
SPECTRAL RESPONSE
INPUT FREQUENCY (MHz)
INPUT FREQUENCY (MHz)
4
10
EE
6
and V
f
S
f
IN
= 40Msps
8
= 1MHz
CC
, and
100
10
5