OPA650 Burr-Brown, OPA650 Datasheet - Page 8

• Manufacturer Part Number: OPA650
• Description: Wideband / Low Power Voltage Feedback OPERATIONAL AMPLIFIER
• Manufacturer: Burr-Brown

d) Connections to other wideband devices on the board
may be made with short direct traces or through on-board
transmission lines. For short connections, consider the trace
and the input to the next device as a lumped capacitive load.
Relatively wide traces (50 to 100 mils) should be used,
preferably with ground and power planes opened up around
them. Estimate the total capacitive load and set R
the plot of recommended R
parasitic loads may not need an R
nominally compensated to operate with a 2pF parasitic load.
If a long trace is required and the 6dB signal loss intrinsic to
doubly terminated transmission lines is acceptable, imple-
ment a matched impedance transmission line using microstrip
or stripline techniques (consult an ECL design handbook for
microstrip and stripline layout techniques). A 50 environ-
ment is not necessary on board, and in fact a higher imped-
ance environment will improve distortion as shown in the
distortion vs load plot. With a characteristic impedance
defined based on board material and desired trace dimen-
sions, a matching series resistor into the trace from the
output of the amplifier is used as well as a terminating shunt
resistor at the input of the destination device. Remember
also that the terminating impedance will be the parallel
combination of the shunt resistor and the input impedance of
the destination device; the total effective impedance should
match the trace impedance. Multiple destination devices are
best handled as separate transmission lines, each with their
own series and shunt terminations.
If the 6dB attenuation loss of a doubly terminated line is
unacceptable, a long trace can be series-terminated at the
source end only. This will help isolate the line capacitance
from the op amp output, but will not preserve signal integrity
as well as a doubly terminated line. If the shunt impedance
at the destination end is finite, there will be some signal
attenuation due to the voltage divider formed by the series
and shunt impedances.
e) Socketing a high speed part like the OPA650 is not
recommended. The additional lead length and pin-to-pin
capacitance introduced by the socket creates an extremely
troublesome parasitic network which can make it almost
impossible to achieve a smooth, stable response. Best results
are obtained by soldering the part onto the board. If socket-
ing for the DIP package is desired, high frequency flush
mount pins (e.g., McKenzie Technology #710C) can give
good results.
The OPA650 is nominally specified for operation using 5V
power supplies. A 10% tolerance on the supplies, or an ECL
–5.2V for the negative supply, is within the maximum speci-
fied total supply voltage of 11V. Higher supply voltages can
break down internal junctions possibly leading to catastrophic
failure. Single supply operation is possible as long as com-
mon mode voltage constraints are observed. The common
mode input and output voltage specifications can be inter-
preted as a required headroom to the supply voltage. Observ-
ing this input and output headroom requirement will allow
non-standard or single supply operation. Figure 1 shows one
approach to single-supply operation.
®
OPA650
ISO
vs capacitive load. Low
ISO
since the OPA650 is
ISO
from
8
FIGURE 1. Single Supply Operation.
OFFSET VOLTAGE ADJUSTMENT
If additional offset adjustment is needed, the circuit in
Figure 2 can be used without degrading offset drift with
temperature. Avoid external adjustment whenever possible
since extraneous noise, such as power supply noise, can be
inadvertently coupled into the amplifier’s inverting input
terminal. Remember that additional offset errors can be
created by the amplifier’s input bias currents. Whenever
possible, match the impedance seen by both inputs as is
shown with R
the amplifier’s offset current.
FIGURE 2. Offset Voltage Trim.
ESD PROTECTION
ESD damage has been well recognized for MOSFET de-
vices, but any semiconductor device is vulnerable to this
potentially damaging source. This is particularly true for
very high speed, fine geometry processes.
ESD damage can cause subtle changes in amplifier input
characteristics without necessarily destroying the device. In
precision operational amplifiers, this may cause a noticeable
degradation of offset voltage and drift. Therefore, ESD
handling precautions are strongly recommended when han-
dling the OPA650.
NOTE: (1) R
optional and can
be used to cancel
offset errors due
to input bias currents.
V
AC
20k
3
3
is
. This will reduce input bias current errors to
+V
–V
+V
S
S
S
Output Trim Range
V
2
S
402
0.1µF
OPA650
+V
R
47k
402
Trim
S
R
1
V
IN
V
or Ground
OUT
+V
=
V
S
2
S
(1)
R
OPA650
R
R
Trim
+ 2•V
R
2
3
R
OUT
= R
2
to –V
AC
1
|| R
S
2
R
R
L
R
Trim
2