USBLC6-4 STMicroelectronics, USBLC6-4 Datasheet - Page 11

• Manufacturer Part Number: USBLC6-4
• Description: Very low capacitance ESD protection
• Manufacturer: STMicroelectronics

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USBLC6-4
4
Package information
●
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 3.
Figure 20. SOT23-6L footprint (mm)
b
c
Epoxy meets UL94, V0
3.50
2.30
E
H
SOT23-6L dimensions
L
0.95
e
e
A1
0.60
A2
A
1.20
1.10
D
Figure 21. SOT23-6L marking
REF.
A1
A2
A
C
D
E
H
b
e
L
Min.
0.90
0.90
0.35
0.09
2.80
1.50
2.60
0.10
0°
0
Millimeters
x x x
z
Typ.
0.95
y w w
e3
Dimensions
Max.
1.45 0.035
0.10
1.30 0.035
0.50 0.014
0.20 0.004
3.05 0.110
1.75 0.059
3.00 0.102
0.60 0.004
10°
Package information
Min.
0°
0
e3: ECOPACK (Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Inches
0.037
Typ.
®
0.057
0.004
0.051
0.008
0.120
0.069
0.118
0.024
Max.
0.02
10°
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