MCP1727 Microchip Technology, MCP1727 Datasheet - Page 24

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MCP1727

Manufacturer Part Number
MCP1727
Description
Low Quiescent Current LDO Regulator
Manufacturer
Microchip Technology
Datasheet

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MCP1727
8-Lead Plastic Dual Flat, No Lead Package (MF) – 3x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21999B-page 24
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Width
Overall Width
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
E
A
EXPOSED PAD
NOTE 2
Units
A1
A3
E2
D2
N
A
D
E
K
e
b
L
K
0.80
0.00
0.00
0.00
0.25
0.20
0.20
MIN
MILLIMETERS
0.65 BSC
0.20 REF
3.00 BSC
3.00 BSC
b
BOTTOM VIEW
NOM
0.90
0.02
0.30
0.30
8
Microchip Technology Drawing C04-062B
D2
© 2007 Microchip Technology Inc.
2
e
MAX
1
1.00
0.05
1.60
2.40
0.35
0.55
N
E2
NOTE 1
L

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