STPS41L45CT STMicroelectronics, STPS41L45CT Datasheet
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STPS41L45CT
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STPS41L45CT Summary of contents
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... STPS41L45CG/CT/ 150 °C 0.47 V STPS41L45CR Parameter Tc = 130° sinusoidal tp=2 µs square F=1kHz tp = 1µ 25° TO-220AB I PAK STPS41L45CT PAK STPS41L45CG Value Per diode 40 Per device 220 1 10000 - 175 150 10000 A2 ...
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... STPS41L45CG / STPS41L45CT / STPS41L45CR THERMAL RESISTANCES Symbol R Junction to case th(j-c) R Coupling th(c) When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode1 th(j-c) STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol Parameter I * Reverse leakage current Forward voltage drop F Pulse test : * tp = 380 µs, < evaluate the conduction losses use the following equation : ...
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... Tj=150°C 1.E+02 Tj=125°C Tj=100°C 1.E+01 Tj=75°C 1.E+00 Tj=50°C 1.E-01 Tj=25°C VR(V) 1.E- STPS41L45CG / STPS41L45CT / STPS41L45CR Fig. 4: Normalized avalanche power derating versus junction temperature. P ARM p P ARM 1.2 1 0.8 0.6 0.4 0 100 1000 Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) 1 ...
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... STPS41L45CG / STPS41L45CT / STPS41L45CR Fig. 9: Forward voltage drop versus forward current. IFM(A) 100 Tj=125°C Tj=125°C (Maximum values) (Maximum values) Tj=125°C Tj=125°C (Typical values) (Typical values) 10 Tj=25°C (Maximum values) VFM(V) 1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 PACKAGE MECHANICAL DATA 2 D PAK FLAT ZONE NO LESS THAN 2mm FOOTPRINT (dimensions in mm) 16 ...
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... PACKAGE MECHANICAL DATA 2 I PAK STPS41L45CG / STPS41L45CT / STPS41L45CR REF DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 0.098 0.106 0.70 0.93 0.028 0.037 1.14 1.17 0.044 0.046 1.14 1.17 0.044 0.046 0.45 0.60 0.018 0.024 1 ...
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... STPS41L45CG / STPS41L45CT / STPS41L45CR PACKAGE MECHANICAL DATA TO-220AB H2 Dia Ordering type Marking STPS41L45CG STPS41L45CG STPS41L45CG-TR STPS41L45CG STPS41L45CT STPS41L45CT STPS41L45CR STPS41L45CR EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use ...