130MR2C HB Electronic Components, 130MR2C Datasheet - Page 6

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130MR2C

Manufacturer Part Number
130MR2C
Description
Led Specification
Manufacturer
HB Electronic Components
Datasheet
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to
5) Lead cutting after soldering should be performed only after the LED temperature has returned to
yLED MOUNTING METHOD
1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on
avoid steering the leads (See Fig.3).
preserve the soldering conditions with irons stated above: select a best-suited method that
assures the least stress to the LED.
normal temperature.
the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective
components including the LED should be taken into account especially when designing the
case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the
diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the
shape of the holes should be made oval. (See Fig.4)
pc board
LED LAMP APPLICATION
Fig.4
case
LJ
)
MLJ
Page : 6

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