130PG2C HB Electronic Components, 130PG2C Datasheet

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130PG2C

Manufacturer Part Number
130PG2C
Description
Led Specification
Manufacturer
HB Electronic Components
Datasheet
¾
z Single color/
z High bright output/
z Low power consumption/
z High reliability and long life/
Features/
Hebei I.T. (Shanghai) Co., Ltd
Http //www.hebeiltd.com.cn
NOTE:
z All dimensions are millimeters/
z Tolerance is +/-0.25mm unless otherwise noted/
t
3.3±0.2
2.54±0.2
0.25mm
¾ Descriptions/
Super Bright Blue Green/
z
z
z
z
Dice material/
Emitting Color/
Device Outline/
Lens Type
Special Type/
2.4±0.2
0.5±0.2
Water Clear/
mm.
Part No. 130PG2C
.
LED SPECIFICATION
Page: 1 of 3
InGaN

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130PG2C Summary of contents

Page 1

... All dimensions are millimeters/ z Tolerance is +/-0.25mm unless otherwise noted/ Http //www.hebeiltd.com.cn ¾ Descriptions/ z Dice material/ z Emitting Color/ t Super Bright Blue Green/ z Device Outline/ Special Type/ z Lens Type Water Clear/ 2.4±0.2 3.3±0.2 0.5±0.2 2.54±0.2 mm. 0.25mm LED SPECIFICATION Part No. 130PG2C InGaN . Page ...

Page 2

... Symbol Test Condition 20mA 20mA 20mA 20mA 20mA V F LED SPECIFICATION Part No. 130PG2C Values Unit Min. Max ---- 30 mA ---- 80 mW ---- 100 mA -40 +85 -40 +100 Values Unit Min. Typ. Max. ---- 3.2 3.6 ---- ---- ...

Page 3

... Ambient Temperature T 100 Http //www.hebeiltd.com.cn Vs. Fig.2 2.5 2.0 1.5 1.0 0.5 0 2.3 2.5 2.7 0 Vs. Fig.4 2.5 2.0 1.5 1.0 0.5 0 100 Fig.5 Vs. 550 400 450 500 Wavelength (nm)/ LED SPECIFICATION Part No. 130PG2C / Vs IF-Forward Current (mA) Vs. - Ambient Temperature 650 600 Page ...

Page 4

BRIGHTNESS BIN Bin Code IV(mcd) Bin Code A 0-5 5.0-7 7.0-9 9.8-13 13.7-19 19.0-26 26.6-37.2 P WAVELENGTH BIN Ligth Col. Bin Code Wavel. (nm) Ligth Col. Bin Code ...

Page 5

METHOD SOLDERING CONDITIONS DIP Bath temperature: 260±5 SOLDERING Immersion time: with 5 sec Soldering iron: 30W or smaller SOLDERING Temperature at tip of iron: 260 IRON Soldering time: within 5 sec. 1) When soldering the lead of LED in ...

Page 6

Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3). 4) Repositioning after soldering should be avoided as much as possible. If inevitable, ...

Page 7

Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. Stand-off Fig.5 yFORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. ...

Page 8

STRENGTH 1) Bend strength Do not bend the lead more than twice. (Fig.9) Fig.9 2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) 2. yHANDLING PRECAUTIONS Although rigid against vibration, ...

Page 9

Experiment Item: Item OPERATION LIFE HIGH TEMPERATURE HIGH HUMIDITY STORAGE TEMPERATURE CYCLING THERMAL SHOCK SOLDER RESISTANCE SOLDERABILITY Drive Method Circuit model A (A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED. ...

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