BA2901FV ROHM Electronics, BA2901FV Datasheet - Page 17

• Manufacturer Part Number: BA2901FV
• Description: Comparators : Ground Sense; Power supply (V): 2 to 36; Number of channels: 4; Circuit current (mA): 0.8; Input offset voltage (mV): 2; Input bias current (nA): 50; Response time ( us): 1.3; Operating temperature range (°C): -40 to 125; Package: S
• Manufacturer: ROHM Electronics

BA10393F,BA10339F/FV,BA2903SF/FV/FVM,BA2903F/FV/FVM，
BA2903HFVM-C,BA2901SF/FV/KN,BA2901F/FV/KN
●Precautions
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www.rohm.com
1) Unused circuits
2) Input terminal voltage
3) Power supply (single / dual)
4) Power dissipation Pd
5) Short-circuit between pins and erroneous mounting
6) Terminal short-circuits
7) Operation in a strong electromagnetic field
8) Radiation
9) IC handing
10) Board inspection
When there are unused circuits it is recommended that they beconnected as
in Fig.93, setting the non-inverting input terminal to a potential within the in-phase
input voltage range (VICR).
(BA2903S/BA2903/BA2901S/BA2901 family, BA2903HFVM-C)Applying
VEE + 36Vto the input terminal is possible without causing deterioration of
the electrical characteristics or destruction, irrespective of the supply voltage.
However,this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input voltage is
within the common mode input voltage range of the electric characteristics.
The op-amp operates when the specified voltage supplied is between VCC and VEE. Therefore, the single supply op-amp
can be used as a dual supply op-amp as well.
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in
chip temperature, including reduced current capability.
Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a
sufficient margin in thermal design. Refer to the thermal derating curves for more information.
Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and
the power supply, or the output and GND may result in IC destruction.
When the output and VCC terminals are shorted, excessive output current may flow, resulting in undue heat generation
and, subsequently, destruction.
Operation in a strong electromagnetic field may cause malfunctions.
This IC is not designed to withstand radiation.
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezoelectric (piezo) effects.
Connecting a capacitor to a pin with low impedance may stress the IC.
Therefore, discharging the capacitor after every process is recommended. In addition, when attaching and detaching
the jig during the inspection phase, ensure that the power is turned off before inspection and removal .
Furthermore, please take measures against ESD in the assembly process as well as during transportation and storage.
17/19
Please keep this
potencial in Vicm
同相入力電圧
範囲内の電位
Fig.93 Disable circuit example
図1 未使用回路の処理例
＋
－
Technical Note
2009.05 - Rev.A
VCC
VEE
OPEN