BA2901FV ROHM Electronics, BA2901FV Datasheet - Page 16

• Manufacturer Part Number: BA2901FV
• Description: Comparators : Ground Sense; Power supply (V): 2 to 36; Number of channels: 4; Circuit current (mA): 0.8; Input offset voltage (mV): 2; Input bias current (nA): 50; Response time ( us): 1.3; Operating temperature range (°C): -40 to 125; Package: S
• Manufacturer: ROHM Electronics

BA10393F,BA10339F/FV,BA2903SF/FV/FVM,BA2903F/FV/FVM，
BA2903HFVM-C,BA2901SF/FV/KN,BA2901F/FV/KN
●Derating curves
© 2009 ROHM Co., Ltd. All rights reserved.
www.rohm.com
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature.The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal resistance
of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the
storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the
package. The parameter which indicatesthis heat dissipation capability(hardness of heat release)is called thermal resistance,
represented by the symbol θja[℃/W].The temperature of IC inside the package can be estimated by this thermal resistance.
Fig.91(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta, junction
temperature Tj, and power dissipation Pd can be calculated by the equation below:
Derating curve in Fig.91(b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can
be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal resistance θja.
Thermal resistance θja depends on chip size, power consumption, package,ambient temperature, package condition, wind
velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a
specified condition. Fig.92(a)～(d) show a derating curve for an example of BA10393, BA10339, BA2903S, BA2903,
BA2903HFVM-C,BA2901S, BA2901.
When using the unit above Ta=25[℃], subtract the value above per degree[℃]. Permissible dissipation is the value
when glass epoxy board 70[mm]×70[mm]×1.6[mm](cooper foil area below 3[%]) is mounted.
（*5）
6.2
Chip surface temperature
Ambient temperature
Power dissipation
θja = ( Tj ー Ta ) / Pd [ ℃ /W]
1000
800
600
400
200
1000
800
600
400
200
0
（*6）
0
チップ 表面温度 Tj [ ℃ ]
消費電力 P [W]
0
(a) Thermal resistance
7.0
620mW(
0
780mW(
690mW(
590mW(
周囲温度 Ta [ ℃ ]
Ambient temperature ：Ta [℃]
Ambient temperature ：Ta [℃]
★
25
5)
★
★
★
25
(a)BA10393 family
8)
10)
9)
(c)BA2903 family
周囲温度 Ta [°C]
周囲温度 Ta [°C]
θja ＝ (Tj-Ta) / Pd
50
（*7）
50
BA2903SFVM
4.9
BA2903SFV
BA10393F
BA2903FV
75
BA2903FVM
BA2903HFVM－C
75
100
Fig.91 Thermal resistance and derating curve
105
（*8）
100
6.2
125
BA2903SF
125
150
Fig.92 Derating curve
[℃/W]
（*9）
5.5
Power dissipation of LSI
16/19
（*10）
LSI の 消 費 電 力 [W]
P2
P1
・・・・・ (Ⅰ)
4.7
0
1000
1000
800
600
400
200
800
600
400
200
Pd (max)
0
0
0
0
490mW(
660mW(
610mW(
700mW(
870mW(
Ambient temperature
25
Ambient temperature ：Ta [℃]
(b) Derating curve
Ambient temperature ：Ta [℃]
25
★
★
★
★
★
（*11）
6)
7)
(b)BA10339 family
12)
13)
25
11)
(d)BA2901 family
7.0
周囲温度 Ta [°C]
50
50
θ' ja1
周 囲 温 度 Ta [ ℃ ]
50
BA2901SKN
BA2901SF
BA10339FV
BA2901FV
75
75
θ ja1
θja2 < θja1
BA10339F
（*12）
75
100
θ' ja2
BA2901F
5.3
105
100
BA2901SFV
100
θ ja2
125
125
150
（*13）
125
Tj ' (max)
4.9
150
Technical Note
2009.05 - Rev.A
Tj (max)
[mW/℃]
Unit