LT6004 Linear Technology Corporation, LT6004 Datasheet - Page 19

• Manufacturer Part Number: LT6004
• Description: 1.6v, 1?a Precision Rail-to-rail Input And Output Op Amp
• Manufacturer: Linear Technology Corporation

package Description
3.50 ±0.05
(0.178 – 0.249)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
.007 – .0098
2.20 ±0.05
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
(0.38 ± 0.10)
.015 ± .004
1.65 ±0.05
PACKAGE OUTLINE MO-229
(2 SIDES)
(0.406 – 1.270)
.016 – .050
(MILLIMETERS)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
INCHES
× 45°
3. DRAWING NOT TO SCALE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
0° – 8°
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
4.40 ±0.05
(2 SIDES)
TYP
(0.203 – 0.305)
.008 – .012
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
TYP
0.50 BSC
0.25 ± 0.05
.0532 – .0688
(1.35 – 1.75)
0.65 ±0.05
16-Lead Plastic SSOP (Narrow .150 Inch)
PACKAGE
OUTLINE
16-Lead Plastic DFN (5mm × 3mm)
(Reference LTC DWG # 05-08-1706)
(Reference LTC DWG # 05-08-1641)
(SEE NOTE 6)
TOP MARK
(0.635)
.0250
PIN 1
BSC
0.200 REF
(0.102 – 0.249)
.004 – .0098
DHC Package
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
GN Package
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
(5.817 – 6.198)
.229 – .244
5.00 ±0.10
(2 SIDES)
16 15 14 13
1
2 3
(4.801 – 4.978)
.189 – .196*
4
LT6003/LT6004/LT6005
12 11 10 9
5 6 7
3.00 ±0.10
0.75 ±0.05
(2 SIDES)
8
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
(3.810 – 3.988)
R = 0.20
.150 – .157**
(0.229)
TYP
.009
REF
.254 MIN
.0165 ± .0015
9
8
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD LAYOUT
4.40 ±0.10
(2 SIDES)
R = 0.115
TYP
0.50 BSC
0.25 ± 0.05
16
1
.045 ±.005
.150 – .165

0.40 ± 0.10
GN16 (SSOP) 0204
600345fb
.0250 BSC
(DHC16) DFN 1103
PIN 1
NOTCH