IR3082A International Rectifier Corp., IR3082A Datasheet - Page 29

no-image

IR3082A

Manufacturer Part Number
IR3082A
Description
9.6v Amd Xphasetm Control Ic
Manufacturer
International Rectifier Corp.
Datasheet
LAYOUT GUIDELINES
The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB
layout, therefore minimizing the noise coupled to the IC.
x
x
x
x
x
x
Dedicate at least one middle layer for a ground plane LGND.
Connect the ground tab under the control IC to LGND plane through a via.
Place the following critical components on the same layer as control IC and position them as close as possible
to the respective pins, R
connection.
Place the compensation components on the same layer as control IC and position them as close as possible to
EAOUT, FB and VDRP pins. Avoid using any via for the connection.
Use Kelvin connections for the remote voltage sense signals, VOSNS+ and VOSNS-, and avoid crossing over
the fast transition nodes, i.e. switching nodes, gate drive signals and bootstrap nodes.
Control bus signals, VDAC, RMPOUT, IIN, VBIAS, and especially EAOUT, should not cross over the fast
transition nodes.
Page 29 of 33
OSC
, R
OCSET
, R
VDAC
, C
VDAC
, C
VCC
, C
SS/DEL
and R
CC/DEL
. Avoid using any via for the
05/02/2006
IR3082A

Related parts for IR3082A