VND5025BK-E STMicroelectronics, VND5025BK-E Datasheet - Page 24

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VND5025BK-E

Manufacturer Part Number
VND5025BK-E
Description
Double Channel High Side Driver With Analog Current Sense For Automotive Applications
Manufacturer
STMicroelectronics
Datasheet
Package and thermal data
4
4.1
24/31
Package and thermal data
PowerSSO-24™ thermal data
Figure 28. PowerSSO-24™ PC board
Figure 29. R
Layout condition of R
thickness = 1.6mm, Cu thickness = 70µm (front and back side), Copper areas: from minimum pad layout to 8cm
RTHj_amb(°C/W)
55
50
45
40
35
30
channel ON)
0
thj-amb
th
and Z
vs PCB copper area in open box free air condition (with one
th
measurements (PCB: Double layer, Thermal Vias, FR4 area = 77mm x 86mm, PCB
2
PCB Cu heatsink area (cm^2)
4
6
8
10
VND5025BK-E
2
).

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