FMA65N15T2 Fuji Electric holdings CO.,Ltd, FMA65N15T2 Datasheet - Page 6
FMA65N15T2
Manufacturer Part Number
FMA65N15T2
Description
N-channel Enhancement Mode Power Mosfet
Manufacturer
Fuji Electric holdings CO.,Ltd
Datasheet
1.FMA65N15T2.pdf
(19 pages)
8.Reliability test items
Fuji Electric Device Technology Co.,Ltd.
All guaranteed values are under the categories of reliability per non-assembled(only MOSFETs).
Each categories under the guaranteed reliability conform to EIAJ ED4701/100 method104
standards.
Test
No.
Test items required without fail
Humidification treatment (85±2°C,65±5%RH,168±24hr)
Heat treatment of soldering (Solder Dipping,260±5°C(265°Cmax.),10±1sec,2 times)
1 Terminal
2 Terminal
3 Mounting
4 Vibration
5 Shock
6 Solderability
7 Resistance to
Test
Items
Strength
(Tensile)
Strength
(Bending)
Strength
Soldering Heat
Testing methods and Conditions
Pull force
TO-220,TO-220F : 10N
TO-3P,TO-3PF,TO-247 : 25N
TO-3PL : 45N
T-Pack,K-Pack : 10N
Force maintaining duration :30±5sec
Load force
TO-220,TO-220F : 5N
TO-3P,TO-3PF,TO-247 : 10N
TO-3PL : 15N
T-Pack,K-Pack : 5N
Number of times :2times(90deg./time)
Screwing torque value: (M3)
TO-220,TO-220F : 40±10Ncm
TO-3P,TO-3PF,TO-247 : 50±10Ncm
TO-3PL : 70±10Ncm
frequency : 100Hz to 2kHz
Acceleration : 200m/s
Sweeping time : 4min.
48min. for each X,Y&Z directions.
Peak amplitude: 15km/s
Duration time : 0.5ms
3times for each X,Y&Z directions.
Solder temp. : 235 5 C
Immersion time : 5 0.5sec
Each terminal shall be immersed in
the solder bath within 1 to 1.5mm from method 303
the body.
Solder temp. : 260 5 C
Immersion time : 10 1sec
Number of times : 1times
2
2
MS5F6120
Reference
Standard
EIAJ
ED4701/400
method 401
EIAJ
ED4701/400
method 401
EIAJ
ED4701/400
method 402
EIAJ
ED4701/400
method 403
EIAJ
ED4701/400
method 404
EIAJ
ED4701/300
EIAJ
ED4701/300
method 302
Sampling
number
15
15
15
15
15
15
15
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Acceptance
number
(0:1)
H04-004-03
a