PMP5501V NXP Semiconductors, PMP5501V Datasheet - Page 9

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PMP5501V

Manufacturer Part Number
PMP5501V
Description
Pmp5501v; Pmp5501g; Pmp5501y Pnp/pnp Matched Double Transistors
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
10. Packing information
11. Soldering
PMP5501V_G_Y_2
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
Type number Package Description
PMP5501V
PMP5501G
PMP5501Y
Fig 14. Reflow soldering footprint SOT666
For further information and the availability of packing methods, see
T1: normal taping
T2: reverse taping
Reflow soldering is the only recommended soldering method.
Packing methods
PMP5501V; PMP5501G; PMP5501Y
2.00 1.70 1.00
SOT666
SOT353
SOT363
0.075
Rev. 02 — 19 September 2006
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
0.55
(2 )
solder lands
solder resist
2.75
2.45
2.10
1.20
2.20
2.50
1.60
placement area
occupied area
PNP/PNP matched double transistors
Section
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
[2]
[3]
Dimensions in mm
0.30 (2 )
[1]
Packing quantity
3000 4000 8000 10000
-
-
-115
-115
-125
14.
0.375
0.15
(4 )
(4 )
-
-115
-
-
-
0.40
(6 )
-315
-
-
-
-
-
-
-135
-135
-165
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