STW4141 STMicroelectronics, STW4141 Datasheet - Page 26

• Manufacturer Part Number: STW4141
• Description: Single Coil Dual Output Step Down Dc/dc Converter For Digital Base Band And Multimedia Processor Supply
• Manufacturer: STMicroelectronics

Package outline and mechanical data
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Note:
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Package outline and mechanical data
Table 10.
Max mounted height is 1.12 mm. Based on a 0.28 mm ball pad diameter.
Solder paste is 0.15 mm thickness and 0.28 mm diameter.
TFBGA stands for Thin Profile Fine Pitch Ball Grid Array.
Thin profile: The total profile height (DIm A) is measured from the seating plane to the top of
the component.
A = 1.01 to 1.20 mm
Fine pitch < 1.00 mm pitch.
The tolerance of position that controls the location of the pattern of balls with respect to
datums A and B.
For each ball there is a cylindral tolerance zone eee perpendicular to datum C and located
on true position with respect to datums A and B as defined by e. The axis perpendicular to
datum C of each ball must lie within this tolerance zone.
The tolerance of position that controls the location of the balls within the matrix with respect
to each other. For each ball there is a cylindrical tolerance zone fff perpendicular to datum C
and located on true position as defined by e. The axis perpendicular to datum C of each ball
must lie within the tolerance zone.
Each tolerance zone fff in the array is contained entirely in the respective above eee zone
above.
The axis of each ball must be simultaneously in both tolerance zones.
Leadfree package according to JEDEC JESD-020-C
A
A1
A2
b
D
D1
E
E1
e
ddd
eee
fff
Ref
TFBGA 3x3x1.20 16 F4x4 0.50. Package code: L0 - JEDEC/EAIJ
Min.
1.01
0.15
0.25
2.85
2.85
0.85
Typ.
0.82
0.30
3.00
1.50
3.00
1.50
0.50
1.20 (
Max.
0.35
3.15
3.15
0.08
0.15
0.05
Note 1
STw4141
)