STW4141 STMicroelectronics, STW4141 Datasheet - Page 24

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STW4141

Manufacturer Part Number
STW4141
Description
Single Coil Dual Output Step Down Dc/dc Converter For Digital Base Band And Multimedia Processor Supply
Manufacturer
STMicroelectronics
Datasheet

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Application information
4.7.1
4.7.2
24/30
Figure 16. Demoboard top layer
PCB layout
Figure 16
board.
TFBGA16 internal bumps access
Pad centers are at 500 µm distance. Pad diameter is 275 µm. The distance between two
adjacent pad edges is only 225 µm. We recommend a distance for lead-out signals from the
center of pad matrix by 75 µm wide trace. Isolation distance in this case is 75 µm (see
Figure 18
Figure 18. TFBGA16 ball pad spacing and track parameters to internal pads
and
and
Figure 17
Figure 19
Grid dot distance :
).
show the PCB layout. All components are on the top side of the
Figure 17. Demoboard assembled with 22 µF
output capacitor
with
A = 500µm
B = 275µm
C = 75µm
STw4141

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