BYD73 NXP Semiconductors, BYD73 Datasheet - Page 4

• Manufacturer Part Number: BYD73
• Description: Ultra Fast Low-loss Controlled Avalanche Rectifiers
• Manufacturer: NXP Semiconductors

Philips Semiconductors
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.16.
1996 Sep 18
C
R
R
SYMBOL
SYMBOL
dI
--------
d
dt
th j-tp
th j-a
Ultra fast low-loss
controlled avalanche rectifiers
R
For more information please refer to the “General Part of associated Handbook”.
diode capacitance
maximum slope of reverse recovery
current
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
BYD73A to D
BYD73E to G
BYD73A to D
BYD73E to G
PARAMETER
PARAMETER
f = 1 MHz; V
see Fig.15
when switched from
I
and dI
see Fig.17
F
= 1 A to V
CONDITIONS
F
4
/dt = 1 A/ s;
R
R
= 0 V;
30 V
lead length = 10 mm
note 1
CONDITIONS
MIN.
TYP.
50
40
BYD73 series
Product specification
VALUE
MAX.
120
60
4
5
pF
pF
A/ s
A/ s
UNIT
UNIT
K/W
K/W