BYD163 NXP Semiconductors, BYD163 Datasheet - Page 3
BYD163
Manufacturer Part Number
BYD163
Description
Ultra Fast Low-loss Rectifier
Manufacturer
NXP Semiconductors
Datasheet
1.BYD163.pdf
(8 pages)
Philips Semiconductors
THERMAL CHARACTERISTICS
Note
1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 40 m, see Fig.7.
1999 Feb 10
R
R
SYMBOL
th j-tp
th j-a
Ultra fast low-loss rectifier
For more information please refer to the “General Part of associated Handbook” .
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
PARAMETER
3
lead length = 10 mm
note 1
CONDITIONS
Product specification
VALUE
120
60
BYD163
UNIT
K/W
K/W
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