BYD147 NXP Semiconductors, BYD147 Datasheet - Page 3
BYD147
Manufacturer Part Number
BYD147
Description
Ultra Fast Low-loss Rectifier
Manufacturer
NXP Semiconductors
Datasheet
1.BYD147.pdf
(8 pages)
Philips Semiconductors
THERMAL CHARACTERISTICS
Note
1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 40 m, see Fig.7.
1999 Nov 11
R
R
SYMBOL
th j-tp
th j-a
Ultra fast low-loss rectifier
For more information please refer to the “General part of the associated handbook” .
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
PARAMETER
3
note 1
CONDITIONS
Product specification
VALUE
150
30
BYD147
UNIT
K/W
K/W
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