VNQ600P STMicroelectronics, VNQ600P Datasheet - Page 15

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VNQ600P

Manufacturer Part Number
VNQ600P
Description
Quad Channel High Side Driver
Manufacturer
STMicroelectronics
Datasheet

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SO-28 Thermal Data
Figure 21. SO-28 Double Island PC Board
Table 13. Thermal Calculation According to the PCB Heatsink Area
Note:R
Note:R
Note:R
Figure 22. R
Chip 1
OFF
ON
ON
ON
thA
thB
thC
Layout condition of R
Cu thickness=35 m, Copper areas: 0.5cm
= Thermal resistance Junction to Ambient with one chip ON
= Thermal resistance Junction to Ambient with both chips ON and P
= Mutual thermal resistance
Chip 2
OFF
RTHj_am b
ON
ON
ON
thj-amb
70
60
50
40
30
20
10
(°C/W)
0
R
R
R
(R
Vs PCB Copper Area In Open Box Free Air Condition
thA
thC
thB
thA
x P
x (P
x P
x P
th
dchip1
dchip2
dchip1
dchip1
1
and Z
+ T
+ T
) + R
+ P
PCB Cu heatsink area (cm ^2)/island
th
T
amb
amb
measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm,
jchip1
dchip2
thC
2
x P
) + T
dchip2
amb
2
, 3cm
+ T
3
amb
2
, 6cm
R
R
R
(R
2
).
thC
thA
thB
thA
4
x P
x (P
x P
x P
dchip1
dchip2
dchip2
dchip1
+ T
) + R
5
+ T
+ P
dchip1
T
jchip2
amb
amb
dchip2
thC
=P
x P
dchip2
) + T
dchip1
6
amb
R
R
R
thA
thB
thC
+ T
amb
7
P
P
dchip1
dchip1
VNQ600P
Note
=P
P
dchip2
dchip2
15/20

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