SI8901EDB Vishay, SI8901EDB Datasheet - Page 5

• Manufacturer Part Number: SI8901EDB
• Description: Bi-directional P-channel 20-v D-s Mosfet
• Manufacturer: Vishay

MICRO FOOT: 6-BUMP (2 X 3, 0.8-mm PITCH)
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and
Package Reliability represent a composite of all qualified locations.
http://www.vishay.com/ppg?72941.
Document Number: 72941
S-50066—Rev. B, 17-Jan-05
PACKAGE OUTLINE
NOTES (Unless Otherwise Specified):
1.
2.
3.
4.
6 solder bumps are Eutetic 63Sn/37Pb with diameter 0.37 − 0.41 mm
Backside surface is coated with a Ag/Ni/Ti layer
Non-solder mask defined copper landing pad.
Laser marks on the silicon die back
Mark on Backside of Die
Recommended Land
8901E
e
xxx
* Use millimeters as the primary measurement.
Dim
A
A
e
A
D
b
E
e
s
1
2
6
Note 3
Solder Mask −0.4
0.30 X 0.31
MILLIMETERS*
0.600
0.260
0.340
0.370
0.750
0.380
Min
1.52
2.32
e
For related documents such as package/tape drawings, part marking, and reliability data, see
Max
0.650
0.290
0.360
0.410
0.850
0.400
1.6
2.4
0.0236
0.0134
0.0146
0.0598
0.0913
0.0295
0.0150
0.102
Min
INCHES
s
0.0256
0.0142
0.0161
0.0630
0.0945
0.0335
0.0157
Max
0.114
Note 2
e
E
Vishay Siliconix
e
Bump Note 1
b Diameter
Si8901EDB
www.vishay.com
e
s
A
A
2
1
A
D
5