RHR1K160 Intersil Corporation, RHR1K160 Datasheet - Page 6

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RHR1K160

Manufacturer Part Number
RHR1K160
Description
1a, 600v Hyperfast Diode
Manufacturer
Intersil Corporation
Datasheet

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The transient thermal impedance (Z
various top copper board areas. Figure 14 shows the effect
of copper pad area on the single pulse transient thermal
impedance. Each trace represents a copper pad area in
square inches corresponding to the descending list in the
graph. Spice and SABER thermal models are provided for
each of the listed pad areas.
150
100
50
0
10
-1
COPPER BOARD AREA - DESCENDING ORDER
0.049 in
0.296 in
0.523 in
0.769 in
1.000 in
2
2
2
2
2
3-6
FIGURE 14. TRANSIENT THERMAL IMPEDANCE vs MOUNTING PAD AREA
JA
) is also effected by
10
0
t, RECTANGULAR PULSE DURATION (s)
RHR1K160
10
Copper pad area has no perceivable effect on transient
thermal impedance for pulse widths less than 100ms. For
pulse widths less than 100ms the transient thermal
impedance is determined by the die and package. Therefore,
CTHERM1 through CTHERM5 and RTHERM1 through
RTHERM4 remain constant for each of the thermal models.
A listing of the model component values is available in
Table 1.
1
10
2
10
3

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