RHR1K160 Intersil Corporation, RHR1K160 Datasheet - Page 5

• Manufacturer Part Number: RHR1K160
• Description: 1a, 600v Hyperfast Diode
• Manufacturer: Intersil Corporation

Test Circuits and Waveforms
Thermal Resistance vs Mounting Pad Area
The maximum rated junction temperature, T
thermal resistance of the heat dissipating path determines
the maximum allowable device power dissipation, P
application. Therefore the application’s ambient temperature,
T
reviewed to ensure that T
mathematically represents the relationship and serves as
the basis for establishing the rating of the part.
In using surface mount devices such as the SO-8 package,
the environment in which it is applied will have a significant
influence on the part’s current and maximum power
dissipation ratings. Precise determination of the P
complex and influenced by many factors:
Intersil provides thermal information to assist the designer’s
preliminary application evaluation. Figure 13 defines the
R
(component side) area. This is for a horizontally positioned
FR-4 board with 2 oz. copper after 1000 seconds of steady
state power with no air flow. This graph provides the
necessary information for calculation of the steady state
P
1. Mounting pad area onto which the device is attached and
2. The number of copper layers and the thickness of the
3. The use of external heat sinks.
4. The use of thermal vias.
5. Air flow and board orientation.
6. For non steady state applications, the pulse width, the
A
DM
JA
(
o
whether there is copper on one side or both sides of the
board.
board.
duty cycle and the transient thermal response of the part,
the board and the environment they are in.
C), and thermal resistance R
for the device as a function of the top copper
=
FIGURE 11. AVALANCHE ENERGY TEST CIRCUIT
---------------------------- -
L = 20mH
R < 0.1
E
Q
T
AVL
1
JM
Z
= IGBT (BV
= 1/2LI
–
JA
T
A
Q
2
1
[V
CES
R(AVL)
> DUT V
JM
/(V
3-5
DUT
CURRENT
is never exceeded. Equation 1
R(AVL)
SENSE
R(AVL)
- V
JA
)
DD
(
o
)]
L
C/W) must be
(Continued)
JM
R
, and the
+
V
-
V
DM
DD
DD
DM
is
(EQ. 1)
, in an
RHR1K160
junction temperature or power dissipation. Pulse
applications can be evaluated using the Intersil device Spice
thermal model or manually utilizing the normalized maximum
transient thermal impedance curve.
Displayed on the curve are R
Electrical Specifications table. These points were chosen to
depict the compromise between the copper board area, the
thermal resistance and ultimately the power dissipation,
P
component side copper areas can be obtained from Figure
13 or by calculation using Equation 2. The area, in square
inches is the top copper area including the cathode pad
area.
R
DM
FIGURE 12. AVALANCHE CURRENT AND VOLTAGE
FIGURE 13. THERMAL RESISTANCE vs MOUNTING PAD
I V
JA
. Thermal resistances corresponding to other
=
t
0
101.6 25.82
350
300
250
200
150
100
50
0.001
CATHODE MOUNTING AREA, TOP COPPER AREA (in
217
WAVEFORMS
AREA
–
I
L
o
C/W - 0.0123in
ln
t
1
0.01
Area
2
V
I
JA
AVL
L
R
JA
values listed in the
= 101.6 - 25.82 x
t
2
177
o
0.1
C/W - 0.054in
ln
t
(AREA)
2
(EQ. 2)
2
1.0
)