CMF02 TOSHIBA Semiconductor CORPORATION, CMF02 Datasheet
CMF02
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CMF02 Summary of contents
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... Therefore the rating applies only to abnormal operation, which seldom occurs during the lifespan of a device. CMF02 = 600 V = 100 ns (max.) (Ta 25°C) Symbol Rating Unit V 600 V RRM I 1.0 (Note (AV) 10 (50 Hz FSM (Note 3) T °C 40~150 j T °C 40~150 stg 180°) 1 CMF02 Unit: mm JEDEC JEITA TOSHIBA 3-4E1A Weight: 0.023 g (typ.) 2007-04-16 ...
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... R th (j-a) (soldering land mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size mm) (soldering land: 2 1.4 mm) (board thickness: 1 (j- Standard Soldering Pad x x 1.4 3.0 2 CMF02 Min Typ. Max Unit 2 100 270 ns ...
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... Device mounted on a ceramic board (board size × 50 mm, land size × 2 mm, board thickness: 0.64 t) 1 100 0.001 0.01 0.1 Time t (s) 3 CMF02 – (AV) 180° 120° 60° Rectangular waveform 0° 360° D Conduction angle D 0.6 0.8 1.0 1 ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 4 CMF02 20070701-EN 2007-04-16 ...