TEA1532P NXP Semiconductors, TEA1532P Datasheet - Page 27

• Manufacturer Part Number: TEA1532P
• Description: Greenchip Tm Ii Smps Control Ic
• Manufacturer: NXP Semiconductors

Philips Semiconductors
21. Contents
1
2
2.1
2.2
2.3
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
7.17
8
9
10
11
12
12.1
13
14
14.1
14.2
14.2.1
14.2.2
14.3
14.3.1
14.3.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Thermal characteristics. . . . . . . . . . . . . . . . . . 13
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
Application information. . . . . . . . . . . . . . . . . . 15
Test information . . . . . . . . . . . . . . . . . . . . . . . . 19
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Distinctive features . . . . . . . . . . . . . . . . . . . . . . 1
Green features . . . . . . . . . . . . . . . . . . . . . . . . . 1
Protection features . . . . . . . . . . . . . . . . . . . . . . 1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Start-up, mains enabling operation level and
undervoltage lock out . . . . . . . . . . . . . . . . . . . . 6
Supply management. . . . . . . . . . . . . . . . . . . . . 6
Current control mode . . . . . . . . . . . . . . . . . . . . 6
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Cycle skipping. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Demagnetization (QR operation) . . . . . . . . . . . 7
Continuous Conduction Mode (CCM). . . . . . . . 7
OverCurrent Protection (OCP) . . . . . . . . . . . . . 7
Control pin protection . . . . . . . . . . . . . . . . . . . . 7
Adjustable slope compensation . . . . . . . . . . . . 7
Minimum and maximum on-time. . . . . . . . . . . . 8
PROTECT and timing input . . . . . . . . . . . . . . . 8
Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 9
Brown-out protection. . . . . . . . . . . . . . . . . . . . 10
OverTemperature protection (OTP) . . . . . . . . 11
Soft start-up (pin SENSE). . . . . . . . . . . . . . . . 11
Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Quality information . . . . . . . . . . . . . . . . . . . . . 19
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Through-hole mount packages . . . . . . . . . . . . 22
Soldering by dipping or by solder wave . . . . . 22
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 22
Surface mount packages . . . . . . . . . . . . . . . . 22
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23
TEA1532(A)P; TEA1532(A)T
14.3.3
14.4
15
16
17
18
19
20
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Published in The Netherlands
Revision history . . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contact information . . . . . . . . . . . . . . . . . . . . 26
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23
Package related soldering information . . . . . . 24
GreenChip II SMPS control IC
Document number: 9397 750 14319
Date of release: 4 February 2005