1ED020I12FA Infineon Technologies Corporation, 1ED020I12FA Datasheet - Page 20

• Manufacturer Part Number: 1ED020I12FA
• Description: Single Igbt Driver Ic
• Manufacturer: Infineon Technologies Corporation

8
8.1
The PCB layout shown in figure 12 represents the reference layout used for the thermal characterisation. Pins 11, 12, 19 and
20 (GND1) and pins 1, 2, 9 and 10 (VEE2) require ground plane connections for achiving maximum power dissipation. The
1ED020I12FA is conceived to dissipate most of the heat generated through this pins.
8.2
Following factors should be taken into account for an optimum PCB layout.
- Sufficient spacing should be kept between high voltage isolated side and low voltage side circuits.
- The same minimum distance between two adjacent high-side isolated parts of the PCB should be maintained to increase the
effective isolation and reduce parasitic coupling.
- In order to ensure low supply ripple and clean switching signals, bypass capacitor trace lengths should be kept as short as
possible.
Datasheet
Application Notes
Reference Layout for Thermal Data
Printed Circuit Board Guidelines
Figure 10: Reference layout for thermal data (Copper thickness 102 m)
PCB + Bottom-Layer
20
PCB + Top-Layer
Version 2.1, 2009-11-24
EICEDRIVER®
Application Notes
1ED020I12FA