NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
... / over any period - Product specification BTA204W series B and C MAX. MAX. MAX. UNIT 600B 800B 600C 800C 500 600 800 SYMBOL T2 G MAX. UNIT -500 -600 -800 1 1 500 ...
... V = 400 125 ˚ T(RMS) dV /dt = 20V/ s; gate open circuit com 0 DRM(max / Product specification BTA204W series B and C MIN. TYP. MAX. UNIT - - 15 K/W - 156 - K K/W TYP. MAX. UNIT ...B ... ...
... I p 20ms. VGT(25 C) 1.6 I TSM 1.4 T time 1.2 1 0.8 0.6 0.4 1000 - Product specification BTA204W series B and C BT134W 108 100 Tsp / C versus solder point temperature T BT134W 0.1 1 surge duration / s , versus surge duration, for sinusoidal T(RMS) currents Hz; T 108˚C. sp VGT(Tj) BT136 0 50 ...
... I (25˚C), Fig.11. Transient thermal impedance 100 150 ( (25˚C Product specification BTA204W series B and C BT134W typ max 0 BT134W unidirectional bidirectional 0.1ms 1ms 10ms 0.1s 1s 10s versus th j-sp pulse width Rev 1.000 ...
... For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0 at 1/8". December 1998 3.8 min 1.5 min 2.3 1.5 min (3x) 1.5 min 4.6 6.7 6.3 3.1 0.32 0.24 2.9 0.10 0. max 1.05 2.3 1.8 max 0.85 4.6 Fig.13. SOT223 surface mounting package. 5 Product specification BTA204W series B and C Dimensions in mm. 6 3.7 7.3 3.3 6 0.80 0 0.60 (4x) Rev 1.000 M A ...
... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. December 1998 BTA204W series B and C 6 Product specification Rev 1.000 ...