STP2003PQFP Sun Microelectronics, STP2003PQFP Datasheet - Page 30

• Manufacturer Part Number: STP2003PQFP
• Description: PCI I/O Controller
• Manufacturer: Sun Microelectronics

M
Package Information and Drawings
PCIO is packaged in a 208-pin, molded PQFP with copper fused lead frame and heat spreader for enhanced
thermal dissipation. The die attach pad is 512 x 512 Mil. Package drawings and mechanical data are shown
below.
Package Marking (Production Version)
DTXXXXX: Lot trace number (e.g. DT06551)
YYYY: Assembly date code (for example: 9542; and only for dates 96XX and later)
TABLE 14: Thermal Characteristics (extrapolated - no air flow)
fused lead frame + heat spreader
30
ECHANICAL
STP2003QFP
Package type
I
NFORMATION
PCIO
PCI I/O Controller
STP2003QFP
100-4183-05
609-0392059
DTXXXXX YYYY
KOREA
(Sun logo)
(Sun Copy rights)
Theta_JA
20.0
Theta_JC
5.0
Sun Part Number
°C/W
Unit
August 2001