MSDC22D-38KX3 Kingmax Semiconductor, MSDC22D-38KX3 Datasheet - Page 9

• Manufacturer Part Number: MSDC22D-38KX3
• Description: DRAM Module, 512 MB PC-2100 DDR SO-DIMM
• Manufacturer: Kingmax Semiconductor

CAPACITANCE
(V
Kingmax - Memory Module
Input Capacitance: Command and Address
Input Capacitance: /CS0, /CS1
Input Capacitance: CK0, /CK0, CK1, /CK1
Input Capacitance: CKE0, CKE1
Input/Output Capacitance: DQs, DQS
DD
= 2.5V, T
7. I/O Setup/Hold Slew Rate Derating
8. I/O Setup/Hold Plateau Derating
9. I/O Delta Rise/Fall Rate(1/slew-rate) Derating
10. This parameter is fir system simulation purpose. It is guaranteed by design.
This derating table is used to increase tDS /tDH in the case where the I/O slew rate is below
0.5V/ns. I/O setup/hold slew rate based on the lesser of AC-AC slew rate and DC-DC slew
rate.
This derating table is used to increase t D S /tDH in the case where the input level i s flat
below VREF ± 310mV for a duration of up to 2ns.
This derating table is used to increase tDS/tDH in the case where the DQ and DQS slew
rates differ. The Delta Rise/Fall Rate is collated as 1/SlewRate1-1/SlewRate2. For example,
if slew rate 1 = 5V/ns and slew rate 2 =.4V/ns then the Delta Rise/Fall Rate = -0/5ns/V.
Input S/H slew rate based on larger of AC-AC delta rise/fall rate and DC-DC delta rise/fall
rate.
I/O Setup/Hold Slew Rate (V/ns)
Delta Rise/Fall Rate (ns/V)
A
= 25 C, f = 1MHz, V
I/O Input Level (mV)
Pin
±0.25
±280
±0.5
0.5
0.4
0.3
0
REF
= 1.25V 100mV)
Symbol
512MB PC-2100 DDR SO-DIMM
9
C
C
C
C
C
tIS (ps)
tIS (ps)
tIS (ps)
+150
+100
IN1
IN2
IN3
IN4
+75
+50
+50
I/O
0
0
Min
20
20
15
16
8
Tih (ps)
tIH (ps)
tIH (ps)
+150
+100
+75
+50
+50
MSDC22D-38KX3
May 2002 Rev: 1.0
0
0
Max
30
30
20
24
12
Unit
pF
pF
pF
pF
pF