74AVC16244DGG,112 NXP Semiconductors, 74AVC16244DGG,112 Datasheet - Page 10

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74AVC16244DGG,112

Manufacturer Part Number
74AVC16244DGG,112
Description
IC BUFF DVR TRI-ST 16BIT 48TSSOP
Manufacturer
NXP Semiconductors
Series
74AVCr
Datasheet

Specifications of 74AVC16244DGG,112

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
4
Number Of Bits Per Element
4
Current - Output High, Low
12mA, 12mA
Voltage - Supply
1.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935264443112
Philips Semiconductors
PACKAGE OUTLINE
1999 Nov 15
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
DIMENSIONS (mm are the original dimensions).
16-bit buffer/line driver; 3-state
(3.6 V tolerant)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT362-1
48
1
Z
max.
y
1.2
A
pin 1 index
0.15
0.05
A
1
1.05
0.85
A
2
IEC
0.25
A
3
e
D
0.28
0.17
b
p
MO-153ED
JEDEC
0.2
0.2
0.1
0.1
c
REFERENCES
12.6
12.4
D
(1)
0
b
p
E
6.2
6.0
(2)
w
scale
EIAJ
M
2.5
10
0.5
25
24
e
H
8.3
7.9
c
E
5 mm
A
L
1
2
A
1
0.8
0.4
L
p
0.50
0.35
Q
H
E
E
PROJECTION
EUROPEAN
detail X
0.25
v
L
L
0.08
p
w
74AVC16244
Q
Product specification
(A )
0.1
y
3
ISSUE DATE
A
93-02-03
95-02-10
0.8
0.4
Z
A
X
SOT362-1
v
M
8
0
o
o
A

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