74HC367DB,112 NXP Semiconductors, 74HC367DB,112 Datasheet - Page 4
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74HC367DB,112
Manufacturer Part Number
74HC367DB,112
Description
IC BUFF DVR TRI-ST HEX 16SSOP
Manufacturer
NXP Semiconductors
Series
74HCr
Datasheets
1.74HCT4046ADB112.pdf
(19 pages)
2.74HCT4046ADB112.pdf
(23 pages)
3.74HCT367N652.pdf
(7 pages)
Specifications of 74HC367DB,112
Package / Case
16-SSOP
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
2, 4 (Hex)
Current - Output High, Low
7.8mA, 7.8mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
74HC
Number Of Channels Per Chip
6
Polarity
Non-Inverting
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 7.8 mA
Input Bias Current (max)
8 uA
Low Level Output Current
7.8 mA
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
8 ns
Number Of Lines (input / Output)
6 / 6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-2668-5
935188700112
935188700112
Philips Semiconductors
January 1996
DIP16: plastic dual in-line package; 16 leads (300 mil)
Package outline drawings
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT38-4
max.
0.17
4.2
A
L
0.020
min.
0.51
A
Z
1
1
16
pin 1 index
max.
0.13
A
3.2
IEC
2
0.068
0.051
1.73
1.30
b
e
0.021
0.015
0.53
0.38
b
1
JEDEC
D
0.049
0.033
1.25
0.85
b
REFERENCES
2
0
b
0.014
0.009
0.36
0.23
c
scale
19.50
18.55
EIAJ
D
0.77
0.73
5
4
(1)
9
8
b
1
6.48
6.20
0.26
0.24
E
(1)
A
b
1
2
w
A
E
10 mm
M
2.54
0.10
2
e
A
7.62
0.30
e
1
3.60
3.05
0.14
0.12
c
L
PROJECTION
EUROPEAN
(e )
M
M
8.25
7.80
0.32
0.31
M
1
H
E
E
10.0
0.39
0.33
M
8.3
H
ISSUE DATE
0.254
0.01
92-11-17
95-01-14
w
SOT38-4
0.030
max.
0.76
Z
(1)