74AUP1G125GF,132 NXP Semiconductors, 74AUP1G125GF,132 Datasheet - Page 2

• Manufacturer Part Number: 74AUP1G125GF,132
• Description: IC BUFF DVR TRI-ST LOW PWR 6XSON
• Manufacturer: NXP Semiconductors
• Series: 74AUPr

Specifications of 74AUP1G125GF,132

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Current - Output High, Low: 4mA, 4mA
• Voltage - Supply: 0.8 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 74AUP1G125GF-H; 74AUP1G125GF-H; 935281121132

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74AUP1G125
Product data sheet
Type number
74AUP1G125GW
74AUP1G125GM
74AUP1G125GF
74AUP1G125GN
74AUP1G125GS
Type number
74AUP1G125GW
74AUP1G125GM
74AUP1G125GF
74AUP1G125GN
74AUP1G125GS
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
2
1
Logic symbol
Ordering information
Marking
OE
A
Package
Temperature range Name
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
mna118
Y
4
All information provided in this document is subject to legal disclaimers.
Fig 2.
TSSOP5
XSON6
XSON6
XSON6
XSON6
Rev. 3 — 1 September 2010
2
1
IEC logic symbol
Description
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
plastic extremely thin small outline package; no leads;
6 terminals; body 1 × 1.45 × 0.5 mm
plastic extremely thin small outline package; no leads;
6 terminals; body 1 × 1 × 0.5 mm
extremely thin small outline package; no leads;
6 terminals; body 0.9 × 1.0 × 0.35 mm
extremely thin small outline package; no leads;
6 terminals; body 1.0 × 1.0 × 0.35 mm
EN
Marking code
pM
pM
pM
pM
pM
mna119
4
[1]
Low-power buffer/line driver; 3-state
Fig 3.
OE
A
74AUP1G125
Logic diagram
© NXP B.V. 2010. All rights reserved.
001aad068
Version
SOT353-1
SOT886
SOT891
SOT1115
SOT1202
2 of 24
Y