74AUP1G125GM,132 NXP Semiconductors, 74AUP1G125GM,132 Datasheet - Page 2

IC BUFF DVR TRI-ST LOW PWR 6XSON

74AUP1G125GM,132

Manufacturer Part Number
74AUP1G125GM,132
Description
IC BUFF DVR TRI-ST LOW PWR 6XSON
Manufacturer
NXP Semiconductors
Series
74AUPr
Datasheet

Specifications of 74AUP1G125GM,132

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
1
Current - Output High, Low
4mA, 4mA
Voltage - Supply
0.8 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
6-XSON (Micropak™), SOT-886
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
74AUP1G125GM-H
74AUP1G125GM-H
935279055132
NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74AUP2G125
Product data sheet
Type number
74AUP2G125DC
74AUP2G125GT
74AUP2G125GF
74AUP2G125GD
74AUP2G125GM
74AUP2G125GN
74AUP2G125GS
Type number
74AUP2G125DC
74AUP2G125GT
74AUP2G125GF
74AUP2G125GD
74AUP2G125GM
74AUP2G125GN
74AUP2G125GS
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
Logic symbol
Ordering information
Marking codes
Package
Temperature range Name
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
1OE
2OE
1A
2A
001aah931
1Y
2Y
All information provided in this document is subject to legal disclaimers.
VSSOP8
XSON8
XSON8
XSON8U
XQFN8U
XSON8
XSON8
Rev. 7 — 21 September 2010
Description
plastic very thin shrink small outline package; 8 leads;
body width 2.3 mm
plastic extremely thin small outline package; no leads;
8 terminals; body 1 × 1.95 × 0.5 mm
extremely thin small outline package; no leads;
8 terminals; body 1.35 × 1 × 0.5 mm
plastic extremely thin small outline package; no leads;
8 terminals; UTLP based; body 3 × 2 × 0.5 mm
plastic extremely thin quad flat package; no leads;
8 terminals; UTLP based; body 1.6 × 1.6 × 0.5 mm
extremely thin small outline package; no leads;
8 terminals; body 1.2 × 1.0 × 0.35 mm
extremely thin small outline package; no leads;
8 terminals; body 1.35 × 1.0 × 0.35 mm
Marking code
p25
p25
aM
p25
p25
aM
aM
Fig 2.
IEC logic symbol
Low-power dual buffer/line driver; 3-state
[1]
EN1
EN2
001aah932
74AUP2G125
1
2
© NXP B.V. 2010. All rights reserved.
Version
SOT765-1
SOT833-1
SOT1089
SOT996-2
SOT902-1
SOT1116
SOT1203
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