74AHCT2G241DC,125 NXP Semiconductors, 74AHCT2G241DC,125 Datasheet
74AHCT2G241DC,125
Specifications of 74AHCT2G241DC,125
74AHCT2G241DC-G
935275137125
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74AHCT2G241DC,125 Summary of contents
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Dual buffer/line driver; 3-state Rev. 02 — 13 January 2009 1. General description The 74AHC2G241; 74AHCT2G241 is a high-speed Si-gate CMOS device. The 74AHC2G241; 74AHCT2G241 is a dual non-inverting buffer/line driver with 3-state outputs. The 3-state outputs are ...
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... NXP Semiconductors 4. Marking Table 2. Marking Type number 74AHC2G241DP 74AHCT2G241DP 74AHC2G241DC 74AHCT2G241DC 74AHC2G241GD 74AHCT2G241GD 5. Functional diagram 1 1OE 2OE 5 2A 001aaa409 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning 74AHC2G241 74AHCT2G241 1OE GND 4 001aaj391 Fig 3. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) 74AHC_AHCT2G241_2 Product data sheet 74AHC2G241 ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin 1OE GND 2OE Functional description [1] Table 4. Function table Input 1OE [ HIGH voltage level LOW voltage level don’t care high-impedance OFF-state. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V) ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions C input I capacitance 74AHCT2G241 V HIGH-level input voltage V LOW-level input voltage V HIGH-level output voltage 8 LOW-level output voltage 8 OFF-state output current input leakage GND current 5.5 V ...
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... NXP Semiconductors Table 8. Dynamic characteristics GND = 0 V; for test circuit see Figure Symbol Parameter Conditions t enable time 1OE to 1Y; see 2OE to 2Y; see disable time 1OE to 1Y; see dis 2OE to 2Y; see 5.5 V ...
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... NXP Semiconductors Table 8. Dynamic characteristics GND = 0 V; for test circuit see Figure Symbol Parameter Conditions t enable time 1OE to 1Y; see 4 5 2OE to 2Y; see disable time 1OE to 1Y; see dis 2OE to 2Y; see power per buffer; PD dissipation pF capacitance ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in Logic levels: V and Fig 5. The input (nA) to output (nY) propagation delays 1OE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in Logic levels: V and Fig 6. The input (1OE) to output 1Y enable and disable times ...
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... NXP Semiconductors 2OE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in Logic levels: V and Fig 7. The input (2OE) to output 2Y enable and disable times Table 9. Measurement points Type 74AHC2G241 74AHCT2G241 74AHC_AHCT2G241_2 Product data sheet 74AHC2G241; 74AHCT2G241 GND t PLZ ...
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... NXP Semiconductors negative positive Test data is given in Table Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 8. Test circuit for measuring switching times Table 10. Test data Type Input ...
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... NXP Semiconductors 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 mm 0.5 0.00 0.15 1.9 OUTLINE VERSION IEC SOT996 Fig 11. Package outline SOT996-2 (XSON8U) ...
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... Data sheet status Product data sheet The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Added type number 74AHC2G241GD and 74AHCT2G241GD (XSON8U package). ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 14 Abbreviations ...