74LCX125MTCX Fairchild Semiconductor, 74LCX125MTCX Datasheet - Page 12
![IC BUFFER QUAD LV N-INV 14TSSOP](/photos/7/8/70852/74lcx125mtcx_sml.jpg)
74LCX125MTCX
Manufacturer Part Number
74LCX125MTCX
Description
IC BUFFER QUAD LV N-INV 14TSSOP
Manufacturer
Fairchild Semiconductor
Series
74LCXr
Datasheet
1.74LCX125MX.pdf
(13 pages)
Specifications of 74LCX125MTCX
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
4
Number Of Bits Per Element
1
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-TSSOP
Logic Family
74LCX
Number Of Channels Per Chip
Quad
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
High Level Output Current
- 24 mA
Input Bias Current (max)
10 uA
Low Level Output Current
24 mA
Maximum Power Dissipation
25 pF
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
6.5 ns @ 2.7 V or 6 ns @ 3.3 V
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
2V To 3.6V
Logic Case Style
TSSOP
No. Of Pins
14
Operating Temperature Range
-40°C To +85°C
Rohs Compliant
Yes
Number Of Lines (input / Output)
4 / 4
Family Type
LCX
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
74LCX125MTCX
74LCX125MTCXTR
74LCX125MTCXTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
74LCX125MTCX
Manufacturer:
Fairchil
Quantity:
5 000
Company:
Part Number:
74LCX125MTCX
Manufacturer:
SAMSUNG
Quantity:
1 840
Part Number:
74LCX125MTCX
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
©1995 Fairchild Semiconductor Corporation
74LCX125 Rev. 1.7.0
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
A. CONFORMS TO JEDEC REGISTRATION MO-153,
B. DIMENSIONS ARE IN MILLIMETERS
E. LANDPATTERN STANDARD: SOP65P640X110-14M
D. DIMENSIONING AND TOLERANCES PER ANSI
F. DRAWING FILE NAME: MTC14REV6
AND TIE BAR EXTRUSIONS
VARIATION AB, REF NOTE 6
Y14.5M, 1982
Figure 6. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
0.43 TYP
(Continued)
12
0.65
R0.09 min
0.45
1.65
1.00
R0.09min
12.00°
TOP & BOTTOM
6.10
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